Introduction

Features:

• Used in the rework and repair of printed circuit boards, computers, cell phones, or other electronics

• Easily removes solder from components or pads on a circuit board

• Concentrated fine copper braiding utilizes less length of wick for each desoldering application

• Made of clean, oxide-free copper wire

• Tight weave enables quick on and off desoldering

• Flux residue on board does not need to be cleaned

• To be used in conjunction with processes using RMA type no-clean fluxes

• 5 and 10 lengths available on static dissipative bobbins in compliance with ESD Association Standard

• Uses flux classification type L0 per IPC J-STD-004B

Wire Specifications:

Bobbin Identification:

makes every attempt to provide accurate information for each item. Actual packaging and/or specifications may be slightly different from the information and picture provided.

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